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1 : $63.0090
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Rochester Electronics ADSP-21369BSWZ-1A
IC DSP 32BIT 266MHZ 208LQFP
Manufacturer # :ADSP-21369BSWZ-1A
Manufacturer :Rochester Electronics
Dasenic # :ADSP-21369BSWZ-1A-DS
Datasheet :
ADSP-21369BSWZ-1A Datasheet
ADSP-21369BSWZ-1A DatasheetCustomer # :
Description : IC DSP 32BIT 266MHZ 208LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 63.0090 | $ 63.01 |
| 10+ | $ 49.6233 | $ 496.23 |
| 25+ | $ 46.2064 | $ 1155.16 |
| 1000+ | $ 35.1180 | $ 35118 |
In Stock: 1540
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 63.009
Total :$ 63.01
Delivery :
Payment :
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ADSP-21369BSWZ-1A information
Rochester Electronics ADSP-21369BSWZ-1A technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:208-LQFP Exposed Pad
- Type:Floating Point
- Interface:DAI, DPI
- Supplier Device Package:208-LQFP-EP (28x28)
- Clock Rate:266MHz
- Non- Volatile Memory:ROM (768kB)
- On- Chip R A M:256kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.20V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-21369BSWZ-1A provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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