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Rochester Electronics ADSP-2101BP-66

16-BIT DIGITAL SIGNAL PROCESSOR
part number has RoHS
Manufacturer # :ADSP-2101BP-66
Manufacturer :Rochester Electronics
Dasenic # :ADSP-2101BP-66-DS
Customer # :
Description : 16-BIT DIGITAL SIGNAL PROCESSOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 41.1300$ 41.13
25+$ 40.3110$ 1007.78
100+$ 38.6640$ 3866.4
500+$ 37.0170$ 18508.5
1000+$ 34.9650$ 34965
In Stock: 3534
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 41.13
Total :$ 41.13
Delivery :
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Payment :
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ADSP-2101BP-66 information

  • Rochester Electronics ADSP-2101BP-66 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:68-LCC (J-Lead)
  • Type:Fixed Point
  • Interface:Host Interface, Serial Port
  • Supplier Device Package:68-PLCC (24.23x24.23)
  • Clock Rate:16.67MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:3kB
  • Voltage - I/ O:5.00V
  • Voltage - Core:5.00V
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Affected
  • US ECCN:3A991A3
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADSP-2101BP-66 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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