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Rochester Electronics ADR435TRZ-EP

IC VREF SERIES 0.04% 8SOIC
part number has RoHS
Manufacturer # :ADR435TRZ-EP
Manufacturer :Rochester Electronics
Dasenic # :ADR435TRZ-EP-DS
Customer # :
Description : IC VREF SERIES 0.04% 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 18.1530$ 18.15
10+$ 13.2102$ 132.1
1000+$ 7.7130$ 7713
In Stock: 12693
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.153
Total :$ 18.15
Delivery :
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Payment :
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ADR435TRZ-EP information

  • Rochester Electronics ADR435TRZ-EP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Voltage Reference
  • Product Status:Active
  • Tolerance:±0.04%
  • Temperature Coefficient:3ppm/°C
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Current - Supply:800µA
  • Voltage - Input:7V ~ 18V
  • Output Type:Fixed
  • Supplier Device Package:8-SOIC
  • Reference Type:Series
  • Current - Output:10 mA
  • Voltage - Output ( Min/ Fixed):5V
  • Voltage - Output ( Max):-
  • Noise - 0.1 Hz to 10 Hz:8µVp-p
  • Noise - 10 Hz to 10k Hz:-
  • Current - Cathode:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADR435TRZ-EP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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