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1 : $0.7117
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Rochester Electronics ADP3153ARU-REEL7
POWER CONTROLLER FOR PENTIUM
Manufacturer # :ADP3153ARU-REEL7
Manufacturer :Rochester Electronics
Dasenic # :ADP3153ARU-REEL7-DS
Datasheet :
ADP3153ARU-REEL7 Datasheet
ADP3153ARU-REEL7 DatasheetCustomer # :
Description : POWER CONTROLLER FOR PENTIUM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.7117 | $ 0.71 |
| 25+ | $ 0.6975 | $ 17.44 |
| 100+ | $ 0.6691 | $ 66.91 |
| 500+ | $ 0.6405 | $ 320.25 |
| 1000+ | $ 0.6050 | $ 605 |
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7117
Total :$ 0.71
Delivery :
Payment :
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ADP3153ARU-REEL7 information
Rochester Electronics ADP3153ARU-REEL7 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Special Purpose
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-TSSOP (0.173", 4.40mm Width)
- Voltage - Input:16V
- Supplier Device Package:20-TSSOP
- Voltage - Output:1.8V ~ 3.5V
- Number of Outputs:1
- Applications:Controller, Intel Pentium® II
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADP3153ARU-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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