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Rochester Electronics ADN2855ACPZ

IC CLK DATA REC GPON 200MHZ
part number has RoHS
Manufacturer # :ADN2855ACPZ
Manufacturer :Rochester Electronics
Dasenic # :ADN2855ACPZ-DS
Customer # :
Description : IC CLK DATA REC GPON 200MHZ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 233.2163$ 233.22
25+$ 228.5579$ 5713.95
100+$ 219.2411$ 21924.11
500+$ 209.8503$ 104925.15
1000+$ 198.2412$ 198241.2
In Stock: 3900
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 233.2163
Total :$ 233.22
Delivery :
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Payment :
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ADN2855ACPZ information

  • Rochester Electronics ADN2855ACPZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-VFQFN Exposed Pad, CSP
  • Supplier Device Package:32-LFCSP-VQ (5x5)
  • Frequency - Max:200MHz
  • Number of Circuits:1
  • Output:LVDS
  • Voltage - Supply:3V ~ 3.6V
  • P L L:Yes
  • Input:CML
  • Ratio - Input: Output:1:1
  • Differential - Input: Output:Yes/Yes
  • Main Purpose:GPON, BPON, GEPON
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:5A991B3
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADN2855ACPZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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