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Rochester Electronics ADN2830ACP32-REEL7

IC LASR CTRLR 1CHAN 5.5V 32LFCSP
part number has RoHS
Manufacturer # :ADN2830ACP32-REEL7
Manufacturer :Rochester Electronics
Dasenic # :ADN2830ACP32-REEL7-DS
Customer # :
Description : IC LASR CTRLR 1CHAN 5.5V 32LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.9000$ 0.9
100+$ 0.8370$ 83.7
1000+$ 0.8100$ 810
10000+$ 0.7650$ 7650
In Stock: 12681
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9
Total :$ 0.90
Delivery :
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Payment :
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ADN2830ACP32-REEL7 information

  • Rochester Electronics ADN2830ACP32-REEL7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Laser Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-WFQFN Exposed Pad, CSP
  • Current - Supply:25 mA
  • Type:Laser Diode Controller (Fiber Optic)
  • Number of Channels:1
  • Supplier Device Package:32-LFCSP-WQ (5x5)
  • Voltage - Supply:4.5V ~ 5.5V
  • Data Rate:-
  • Current - Modulation:-
  • Current - Bias:200 mA
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADN2830ACP32-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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