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Rochester Electronics ADN2812ACPZ

IC CLOCK/DATA RECOVERY 32LFCSP
part number has RoHS
Manufacturer # :ADN2812ACPZ
Manufacturer :Rochester Electronics
Dasenic # :ADN2812ACPZ-DS
Customer # :
Description : IC CLOCK/DATA RECOVERY 32LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
2+$ 36.7555$ 73.51
3+$ 30.1584$ 90.48
5+$ 29.2159$ 146.08
7+$ 28.2735$ 197.91
9+$ 27.3310$ 245.98
In Stock: 7312
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 36.7555
Total :$ 36.76
Delivery :
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Payment :
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ADN2812ACPZ information

  • Rochester Electronics ADN2812ACPZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-WFQFN Exposed Pad, CSP
  • Supplier Device Package:32-LFCSP-WQ (5x5)
  • Frequency - Max:2.7GHz
  • Number of Circuits:1
  • Output:CML
  • Voltage - Supply:3V ~ 3.6V
  • P L L:Yes
  • Input:CML
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • Main Purpose:SONET/SDH
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:5A991B3
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADN2812ACPZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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