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Rochester Electronics ADN2812ACP

IC CLK/DATA RECOVR W/AMP 32LFCSP
part number has RoHS
Manufacturer # :ADN2812ACP
Manufacturer :Rochester Electronics
Dasenic # :ADN2812ACP-DS
Customer # :
Description : IC CLK/DATA RECOVR W/AMP 32LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 94.9590$ 94.96
25+$ 93.0600$ 2326.5
100+$ 89.2620$ 8926.2
500+$ 85.4640$ 42732
1000+$ 80.7120$ 80712
In Stock: 5355
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 94.959
Total :$ 94.96
Delivery :
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ADN2812ACP information

  • Rochester Electronics ADN2812ACP technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-WFQFN Exposed Pad, CSP
  • Supplier Device Package:32-LFCSP-WQ (5x5)
  • Frequency - Max:2.7GHz
  • Number of Circuits:-
  • Output:CML
  • Voltage - Supply:3V ~ 3.6V
  • P L L:Yes
  • Input:CML
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • Main Purpose:SONET/SDH
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:5A991B3
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADN2812ACP provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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