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Rochester Electronics ADN2804ACPZ

IC CLK/DATA REC 622MBPS 32-LFCSP
part number has RoHS
Manufacturer # :ADN2804ACPZ
Manufacturer :Rochester Electronics
Dasenic # :ADN2804ACPZ-DS
Customer # :
Description : IC CLK/DATA REC 622MBPS 32-LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 12.8880$ 12.89
25+$ 12.6270$ 315.68
100+$ 12.1140$ 1211.4
500+$ 11.6010$ 5800.5
1000+$ 10.9530$ 10953
In Stock: 12239
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 12.888
Total :$ 12.89
Delivery :
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Payment :
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ADN2804ACPZ information

  • Rochester Electronics ADN2804ACPZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-WFQFN Exposed Pad, CSP
  • Supplier Device Package:32-LFCSP-WQ (5x5)
  • Frequency - Max:622MHz
  • Number of Circuits:1
  • Output:LVDS
  • Voltage - Supply:3V ~ 3.6V
  • P L L:Yes
  • Input:CML
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • Main Purpose:SONET/SDH
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:5A991B3
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADN2804ACPZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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