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Rochester Electronics ADN2531ACPZ-R2

IC LASER DRIVER 11.3GBPS 16LFCSP
part number has RoHS
Manufacturer # :ADN2531ACPZ-R2
Manufacturer :Rochester Electronics
Dasenic # :ADN2531ACPZ-R2-DS
Customer # :
Description : IC LASER DRIVER 11.3GBPS 16LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 16.0380$ 16.04
25+$ 15.7140$ 392.85
100+$ 15.0750$ 1507.5
500+$ 14.4360$ 7218
1000+$ 13.6350$ 13635
In Stock: 8076
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 16.038
Total :$ 16.04
Delivery :
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Payment :
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ADN2531ACPZ-R2 information

  • Rochester Electronics ADN2531ACPZ-R2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Laser Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 100°C
  • Mounting Type:Surface Mount
  • Package / Case:16-WFQFN Exposed Pad, CSP
  • Current - Supply:36 mA
  • Type:Laser Diode Driver
  • Number of Channels:1
  • Supplier Device Package:16-LFCSP-WQ (3x3)
  • Voltage - Supply:3V ~ 3.6V
  • Data Rate:11.3Gbps
  • Current - Modulation:80mA
  • Current - Bias:100 mA
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADN2531ACPZ-R2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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