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Rochester Electronics ADM1275-3ACPZ

IC HOT SWAP CTRLR GP 20LFCSP
part number has RoHS
Manufacturer # :ADM1275-3ACPZ
Manufacturer :Rochester Electronics
Dasenic # :ADM1275-3ACPZ-DS
Customer # :
Description : IC HOT SWAP CTRLR GP 20LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
6+$ 8.9028$ 53.42
13+$ 7.3044$ 94.96
20+$ 7.0767$ 141.53
27+$ 6.8481$ 184.9
34+$ 6.6204$ 225.09
In Stock: 13200
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.9028
Total :$ 8.90
Delivery :
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Payment :
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ADM1275-3ACPZ information

  • Rochester Electronics ADM1275-3ACPZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:PMBus
  • Mounting Type:Surface Mount
  • Package / Case:20-WQFN Exposed Pad, CSP
  • Current - Supply:5 mA
  • Type:Hot Swap Controller, Monitor
  • Number of Channels:1
  • Supplier Device Package:20-LFCSP-WQ (5x5)
  • Internal Switch(s):No
  • Voltage - Supply:2.95V ~ 20V
  • Programmable Features:Auto Retry, Current Limit, Fault Timeout, Latched Fault, OVP, UVLO
  • Current - Output ( Max):-
  • Applications:General Purpose
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADM1275-3ACPZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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