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1 : $5.6160
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Rochester Electronics ADL5322ACPZ-WP
IC AMP GAIN 700-1000MHZ 8-LFCSP
Manufacturer # :ADL5322ACPZ-WP
Manufacturer :Rochester Electronics
Dasenic # :ADL5322ACPZ-WP-DS
Datasheet :
ADL5322ACPZ-WP Datasheet
ADL5322ACPZ-WP DatasheetCustomer # :
Description : IC AMP GAIN 700-1000MHZ 8-LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 5.6160 | $ 5.62 |
| 25+ | $ 5.5080 | $ 137.7 |
| 100+ | $ 5.2830 | $ 528.3 |
| 500+ | $ 5.0580 | $ 2529 |
| 1000+ | $ 4.7700 | $ 4770 |
In Stock: 23400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.616
Total :$ 5.62
Delivery :
Payment :
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ADL5322ACPZ-WP information
Rochester Electronics ADL5322ACPZ-WP technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Amplifiers
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:8-VFDFN Exposed Pad, CSP
- Frequency:700MHz ~ 1GHz
- Current - Supply:320mA
- Supplier Device Package:8-LFCSP-VD (3x3)
- Voltage - Supply:5V
- Gain:20dB
- Noise Figure:-
- P1d B:-
- R F Type:Cellular, CDMA2000, W-CDMA, GSM
- Test Frequency:-
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:5A991B
- HTS US:8542.33.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADL5322ACPZ-WP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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