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Rochester Electronics ADG936BRU-R

IC RF SWITCH SPDT 2GHZ 20TSSOP
part number has RoHS
Manufacturer # :ADG936BRU-R
Manufacturer :Rochester Electronics
Dasenic # :ADG936BRU-R-DS
Customer # :
Description : IC RF SWITCH SPDT 2GHZ 20TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.2320$ 2.23
25+$ 2.1870$ 54.68
100+$ 2.0970$ 209.7
500+$ 2.0070$ 1003.5
1000+$ 1.8990$ 1899
In Stock: 52097
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.232
Total :$ 2.23
Delivery :
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Payment :
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ADG936BRU-R information

  • Rochester Electronics ADG936BRU-R technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Switches
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Package / Case:20-TSSOP (0.173", 4.40mm Width)
  • Impedance:50Ohm
  • Frequency Range:0Hz ~ 2GHz
  • Supplier Device Package:20-TSSOP
  • Voltage - Supply:1.65V ~ 2.75V
  • Circuit:2 x SPDT
  • Topology:Reflective
  • Insertion Loss:0.9dB
  • Isolation:36dB
  • P1d B:16dBm
  • R F Type:General Purpose
  • Test Frequency:1GHz
  • I I P3:32dBm
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADG936BRU-R provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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