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1 : $2.2320
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Rochester Electronics ADG936BCP-REEL
IC SW DUAL SPDT ABSORPT 20LFCSP
Manufacturer # :ADG936BCP-REEL
Manufacturer :Rochester Electronics
Dasenic # :ADG936BCP-REEL-DS
Datasheet :
ADG936BCP-REEL Datasheet
ADG936BCP-REEL DatasheetCustomer # :
Description : IC SW DUAL SPDT ABSORPT 20LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.2320 | $ 2.23 |
| 25+ | $ 2.1870 | $ 54.68 |
| 100+ | $ 2.0970 | $ 209.7 |
| 500+ | $ 2.0070 | $ 1003.5 |
| 1000+ | $ 1.8990 | $ 1899 |
In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.232
Total :$ 2.23
Delivery :
Payment :
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ADG936BCP-REEL information
Rochester Electronics ADG936BCP-REEL technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Switches
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Package / Case:20-WFQFN Exposed Pad, CSP
- Impedance:50Ohm
- Frequency Range:-
- Supplier Device Package:20-LFCSP (4x4)
- Voltage - Supply:1.65V ~ 2.75V
- Circuit:2 x SPDT
- Topology:Absorptive
- Insertion Loss:-
- Isolation:-
- P1d B:16dBm (typ) P1dB
- R F Type:General Purpose
- Test Frequency:-
- I I P3:32dBm (typ)
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADG936BCP-REEL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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