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Rochester Electronics ADG936BCP-R-REEL7

IC SW DUAL SPDT REFLECT 20LFCSP
part number has RoHS
Manufacturer # :ADG936BCP-R-REEL7
Manufacturer :Rochester Electronics
Dasenic # :ADG936BCP-R-REEL7-DS
Customer # :
Description : IC SW DUAL SPDT REFLECT 20LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.0340$ 2.03
25+$ 1.9890$ 49.73
100+$ 1.9080$ 190.8
500+$ 1.8270$ 913.5
1000+$ 1.7280$ 1728
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.034
Total :$ 2.03
Delivery :
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Payment :
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ADG936BCP-R-REEL7 information

  • Rochester Electronics ADG936BCP-R-REEL7 technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Switches
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Package / Case:20-WFQFN Exposed Pad, CSP
  • Impedance:50Ohm
  • Frequency Range:-
  • Supplier Device Package:20-LFCSP (4x4)
  • Voltage - Supply:1.65V ~ 2.75V
  • Circuit:2 x SPDT
  • Topology:Reflective
  • Insertion Loss:-
  • Isolation:-
  • P1d B:16dBm (typ) P1dB
  • R F Type:General Purpose
  • Test Frequency:-
  • I I P3:32dBm (typ)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADG936BCP-R-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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