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Rochester Electronics ADG774BRZ
Manufacturer # :ADG774BRZ
Manufacturer :Rochester Electronics
Dasenic # :ADG774BRZ-DS
Datasheet : ADG774BRZ Datasheet
Customer # :
Description : IC MUX/DEMUX QUAD 2X1 16SOIC
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In Stock: 6135
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.921
Total :$ 6.92
Delivery :
Payment :
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ADG774BRZ information
Rochester Electronics ADG774BRZ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package:16-SOIC
- Number of Circuits:4
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):2.2Ohm (Typ)
- Voltage - Supply, Single ( V+):3V ~ 5V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:240MHz
- Channel-to- Channel Matching (Δ Ron):150mOhm
- Switch Time ( Ton, Toff) ( Max):15ns, 8ns
- Charge Injection:10pC
- Channel Capacitance ( C S(off), C D(off)):10pF, 20pF
- Current - Leakage ( I S(off)) ( Max):500pA
- Crosstalk:-75dB @ 10MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADG774BRZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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