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Rochester Electronics ADG633YCPZ
Manufacturer # :ADG633YCPZ
Manufacturer :Rochester Electronics
Dasenic # :ADG633YCPZ-DS
Datasheet : ADG633YCPZ Datasheet
Customer # :
Description : IC SWITCH TRIPLE SPDT 16LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 24120
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.068
Total :$ 4.07
Delivery :
Payment :
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ADG633YCPZ information
Rochester Electronics ADG633YCPZ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-VQFN Exposed Pad, CSP
- Supplier Device Package:16-LFCSP-VQ (4x4)
- Number of Circuits:3
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):75Ohm
- Voltage - Supply, Single ( V+):2V ~ 12V
- Voltage - Supply, Dual ( V±):±2V ~ 6V
- -3db Bandwidth:580MHz
- Channel-to- Channel Matching (Δ Ron):800mOhm
- Switch Time ( Ton, Toff) ( Max):95ns, 40ns
- Charge Injection:2pC
- Channel Capacitance ( C S(off), C D(off)):4pF, 7pF
- Current - Leakage ( I S(off)) ( Max):200pA
- Crosstalk:-90dB @ 1MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADG633YCPZ provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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