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Rochester Electronics ADG609BRUZ
Manufacturer # :ADG609BRUZ
Manufacturer :Rochester Electronics
Dasenic # :ADG609BRUZ-DS
Datasheet : ADG609BRUZ Datasheet
Customer # :
Description : IC MULTIPLEXER DUAL 4X1 16TSSOP
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In Stock: 24803
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.8251
Total :$ 2.83
Delivery :
Payment :
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ADG609BRUZ information
Rochester Electronics ADG609BRUZ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package:16-TSSOP
- Number of Circuits:2
- Multiplexer/ Demultiplexer Circuit:4:1
- Switch Circuit:SP4T
- On- State Resistance ( Max):30Ohm
- Voltage - Supply, Single ( V+):3.3V ~ 5V
- Voltage - Supply, Dual ( V±):±5V
- -3db Bandwidth:-
- Channel-to- Channel Matching (Δ Ron):5Ohm (Max)
- Switch Time ( Ton, Toff) ( Max):75ns, 45ns
- Charge Injection:6pC
- Channel Capacitance ( C S(off), C D(off)):9pF, 20pF
- Current - Leakage ( I S(off)) ( Max):500pA
- Crosstalk:-85dB @ 100kHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADG609BRUZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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