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Rochester Electronics ADG3246BCP-REEL7

IC SW BUS 2.5/3.3V 10BIT 24LFCSP
part number has RoHS
Manufacturer # :ADG3246BCP-REEL7
Manufacturer :Rochester Electronics
Dasenic # :ADG3246BCP-REEL7-DS
Customer # :
Description : IC SW BUS 2.5/3.3V 10BIT 24LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.0530$ 1.05
25+$ 1.0350$ 25.88
100+$ 0.9900$ 99
500+$ 0.9450$ 472.5
1000+$ 0.8951$ 895.1
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.053
Total :$ 1.05
Delivery :
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Payment :
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ADG3246BCP-REEL7 information

  • Rochester Electronics ADG3246BCP-REEL7 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:24-WFQFN Exposed Pad, CSP
  • Type:Bus Switch
  • Supplier Device Package:24-LFCSP-WQ (4x4)
  • Voltage - Supply:2.5V, 3.3V
  • Voltage Supply Source:Single Supply
  • Current - Output High, Low:-
  • Circuit:10 x 1:1
  • Independent Circuits:1
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ADG3246BCP-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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