Rochester Electronics ADF7011BRU-REEL

Name: ADF7011BRU-REEL
Brand: Rochester Electronics
SKU: ADF7011BRU-REEL-DS
Price: 8.8137 USD
Availability: InStock
Rating: 4.8 (42 reviews)

in_stock: 7050

MOQ: 1

5 Price Tiers

Manufacturer_part :ADF7011BRU-REEL
Manufacturer :Rochester Electronics
Dasenic_Part :ADF7011BRU-REEL-DS
Datasheet : ADF7011BRU-REEL Datasheet PDF
Description : IC ASK/FSK/GFSK BAND TX 24-TSSOP
package :-
unit_price: $8.8137
total: $8.81

Quantity	unit_price	You Save
1-1	$8.8137	-
2-25	$8.6656	1.7% save
26-100	$8.2953	5.9% save
101-500	$7.9250	10.1% save
501-1000	$7.4806	15.1% save

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Rochester Electronics ADF7011BRU-REEL technical_specifications

Category:RF and Wireless/RF Transmitters

Product Status:Obsolete

Operating Temperature:-40°C ~ 85°C

Features:-

Mounting Type:Surface Mount

Package / Case:24-TSSOP (0.173", 4.40mm Width)

Frequency:433MHz ~ 435MHz, 866MHz ~ 870MHz

Supplier Device Package:24-TSSOP

Data Rate ( Max):76.8kbps

Memory Size:-

Voltage - Supply:2.3V ~ 3.6V

Data Interface:PCB, Surface Mount

Power - Output:-16dBm ~ 12dBm

Modulation or Protocol:ASK, FSK, GFSK, OOK

Antenna Connector:PCB, Surface Mount

Current - Transmitting:34mA

Applications:Data Transfer, RKE, Remote Control/Security Systems

EU RoHS Status:RoHS Compliant

REACH Status:Vendor is not defined

US ECCN:Provided as per user requirements

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

ADF7011BRU-REEL provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.