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Rochester Electronics ADCMP603BCPZ-WP
Manufacturer # :ADCMP603BCPZ-WP
Manufacturer :Rochester Electronics
Dasenic # :ADCMP603BCPZ-WP-DS
Datasheet : ADCMP603BCPZ-WP Datasheet
Customer # :
Description : IC COMP TTL/CMOS 1CHAN 12-LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7470
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.939
Total :$ 6.94
Delivery :
Payment :
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ADCMP603BCPZ-WP information
Rochester Electronics ADCMP603BCPZ-WP technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Comparators
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:12-WFQFN Exposed Pad
- Type:with Latch
- Output Type:CMOS, Complementary, Rail-to-Rail, TTL
- Supplier Device Package:12-LFCSP-WQ (3x3)
- Number of Elements:1
- Voltage - Supply, Single/ Dual (±):2.5V ~ 5.5V
- Voltage - Input Offset ( Max):5mV @ 2.5V
- Current - Input Bias ( Max):5µA @ 2.5V
- Current - Output ( Typ):50mA
- Current - Quiescent ( Max):1.8mA
- C M R R, P S R R ( Typ):50dB CMRR, 50dB PSRR
- Propagation Delay ( Max):5ns
- Hysteresis:100µV
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADCMP603BCPZ-WP provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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