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1 : $61.3620
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Rochester Electronics AD974BN
IC DAS 16BIT 200K 28DIP
Manufacturer # :AD974BN
Manufacturer :Rochester Electronics
Dasenic # :AD974BN-DS
Datasheet :
AD974BN Datasheet
AD974BN DatasheetCustomer # :
Description : IC DAS 16BIT 200K 28DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 61.3620 | $ 61.36 |
| 25+ | $ 60.1380 | $ 1503.45 |
| 100+ | $ 57.6810 | $ 5768.1 |
| 500+ | $ 55.2240 | $ 27612 |
| 1000+ | $ 52.1550 | $ 52155 |
In Stock: 3996
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 61.362
Total :$ 61.36
Delivery :
Payment :
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AD974BN information
Rochester Electronics AD974BN technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:28-DIP (0.600", 15.24mm)
- Type:Data Acquisition System (DAS)
- Number of Channels:4
- Supplier Device Package:28-PDIP
- Voltage - Supply:4.75V ~ 5.25V
- Resolution ( Bits):16 b
- Sampling Rate ( Per Second):200k
- Data Interface:Serial
- Voltage Supply Source:Analog and Digital
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AD974BN provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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