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Rochester Electronics AD9553BCPZ

IC INTEGER-N CLCK GEN 32LFCSP
part number has RoHS
Manufacturer # :AD9553BCPZ
Manufacturer :Rochester Electronics
Dasenic # :AD9553BCPZ-DS
Customer # :
Description : IC INTEGER-N CLCK GEN 32LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 15.7140$ 15.71
10+$ 11.3220$ 113.22
25+$ 10.1927$ 254.82
1000+$ 5.8950$ 5895
In Stock: 6636
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 15.714
Total :$ 15.71
Delivery :
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AD9553BCPZ information

  • Rochester Electronics AD9553BCPZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-WFQFN Exposed Pad, CSP
  • Supplier Device Package:32-LFCSP-WQ (5x5)
  • Frequency - Max:810MHz
  • Number of Circuits:1
  • Output:CMOS, LVDS, LVPECL
  • Voltage - Supply:3.135V ~ 3.465V
  • P L L:Yes
  • Input:CMOS, LVDS, Crystal
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • Main Purpose:Ethernet, GPON, SONET/SHD, T1/E1
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD9553BCPZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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