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1 : $0.7117
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Rochester Electronics AD8353ACP-REEL7
IC RF GAIN BLOCK 8-LFCSP T/R
Manufacturer # :AD8353ACP-REEL7
Manufacturer :Rochester Electronics
Dasenic # :AD8353ACP-REEL7-DS
Datasheet :
AD8353ACP-REEL7 Datasheet
AD8353ACP-REEL7 DatasheetCustomer # :
Description : IC RF GAIN BLOCK 8-LFCSP T/R
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.7117 | $ 0.71 |
| 25+ | $ 0.6975 | $ 17.44 |
| 100+ | $ 0.6691 | $ 66.91 |
| 500+ | $ 0.6405 | $ 320.25 |
| 1000+ | $ 0.6050 | $ 605 |
In Stock: 15829
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7117
Total :$ 0.71
Delivery :
Payment :
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AD8353ACP-REEL7 information
Rochester Electronics AD8353ACP-REEL7 technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Amplifiers
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:8-VFDFN Exposed Pad, CSP
- Frequency:1MHz ~ 2.7GHz
- Current - Supply:35mA ~ 48mA
- Supplier Device Package:8-LFCSP-VD (3x2)
- Voltage - Supply:3V, 5V
- Gain:15.6dB
- Noise Figure:6.8dB
- P1d B:6.3dBm
- R F Type:Cellular, LMDS, MMDS
- Test Frequency:2.7GHz
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD8353ACP-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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