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Rochester Electronics AD813AR-14-REEL

IC AMP TRIPLE VIDEO LP 14-SOIC
part number has RoHS
Manufacturer # :AD813AR-14-REEL
Manufacturer :Rochester Electronics
Dasenic # :AD813AR-14-REEL-DS
Customer # :
Description : IC AMP TRIPLE VIDEO LP 14-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.4260$ 6.43
25+$ 6.3000$ 157.5
100+$ 6.0480$ 604.8
500+$ 5.7870$ 2893.5
1000+$ 5.4630$ 5463
In Stock: 1572
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.426
Total :$ 6.43
Delivery :
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Payment :
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AD813AR-14-REEL information

  • Rochester Electronics AD813AR-14-REEL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Video Amps and Modules
  • Product Status:Obsolete
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Current - Supply:4.5 mA
  • Output Type:-
  • Supplier Device Package:14-SOIC
  • Number of Circuits:3
  • -3db Bandwidth:100 MHz
  • Current - Output / Channel:50 mA
  • Slew Rate:250V/µs
  • Voltage - Supply, Single/ Dual (±):2.4V ~ 36V, ±1.2V ~ 18V
  • Applications:Current Feedback
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD813AR-14-REEL provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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