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Rochester Electronics AD8112JSTZ

IC CROSSPOINT SWIT 16X8 100LQFP
part number has RoHS
Manufacturer # :AD8112JSTZ
Manufacturer :Rochester Electronics
Dasenic # :AD8112JSTZ-DS
Customer # :
Description : IC CROSSPOINT SWIT 16X8 100LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 20.2050$ 20.21
10+$ 16.9092$ 169.09
1000+$ 10.5480$ 10548
In Stock: 6401
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 20.205
Total :$ 20.20
Delivery :
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Payment :
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AD8112JSTZ information

  • Rochester Electronics AD8112JSTZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Analog Switches - Special Purpose
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Features:Buffered
  • Mounting Type:Surface Mount
  • Package / Case:100-LQFP
  • Number of Channels:1
  • Supplier Device Package:100-LQFP (14x14)
  • Multiplexer/ Demultiplexer Circuit:16:8
  • Switch Circuit:-
  • On- State Resistance ( Max):-
  • Voltage - Supply, Single ( V+):-
  • Voltage - Supply, Dual ( V±):±5V ~ 12V
  • -3db Bandwidth:60MHz
  • Applications:Audio, Video
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD8112JSTZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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