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Rochester Electronics AD800-52BRZ

IC CLKDATA RECOVERY PLL 20SOIC
part number has RoHS
Manufacturer # :AD800-52BRZ
Manufacturer :Rochester Electronics
Dasenic # :AD800-52BRZ-DS
Customer # :
Description : IC CLKDATA RECOVERY PLL 20SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 25.3710$ 25.37
25+$ 24.8670$ 621.68
100+$ 23.8500$ 2385
500+$ 22.8330$ 11416.5
1000+$ 21.5640$ 21564
In Stock: 14106
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.371
Total :$ 25.37
Delivery :
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Payment :
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AD800-52BRZ information

  • Rochester Electronics AD800-52BRZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:20-SOIC
  • Frequency - Max:51.84MHz
  • Number of Circuits:1
  • Output:ECL
  • Voltage - Supply:-4.5V ~ -5.5V
  • P L L:Yes
  • Input:ECL
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • Main Purpose:DS-3, STS-1
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:5A991B4A
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD800-52BRZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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