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Rochester Electronics AD7891AS-1

IC DAS 12BIT 8CH HI-SPD 44-MQFP
part number has RoHS
Manufacturer # :AD7891AS-1
Manufacturer :Rochester Electronics
Dasenic # :AD7891AS-1-DS
Customer # :
Description : IC DAS 12BIT 8CH HI-SPD 44-MQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0090$ 0.01
10+$ 0.0090$ 0.09
100+$ 0.0090$ 0.9
500+$ 0.0090$ 4.5
1000+$ 0.0090$ 9
In Stock: 45825
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
Delivery :
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Payment :
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AD7891AS-1 information

  • Rochester Electronics AD7891AS-1 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:44-QFP
  • Type:Data Acquisition System (DAS)
  • Number of Channels:8
  • Supplier Device Package:44-MQFP (10x10)
  • Voltage - Supply:5V
  • Resolution ( Bits):12 b
  • Sampling Rate ( Per Second):500k
  • Data Interface:Serial, Parallel
  • Voltage Supply Source:Single Supply
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD7891AS-1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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