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Rochester Electronics AD7877ACP-REEL7
IC ADC 12BIT TOUCHSCREEN 32LFCSP
Manufacturer # :AD7877ACP-REEL7
Manufacturer :Rochester Electronics
Dasenic # :AD7877ACP-REEL7-DS
Datasheet :
AD7877ACP-REEL7 Datasheet
AD7877ACP-REEL7 DatasheetCustomer # :
Description : IC ADC 12BIT TOUCHSCREEN 32LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.8260 | $ 2.83 |
| 25+ | $ 2.7720 | $ 69.3 |
| 100+ | $ 2.6550 | $ 265.5 |
| 500+ | $ 2.5470 | $ 1273.5 |
| 1000+ | $ 2.4030 | $ 2403 |
In Stock: 8283
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.826
Total :$ 2.83
Delivery :
Payment :
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AD7877ACP-REEL7 information
Rochester Electronics AD7877ACP-REEL7 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Touch Screen Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-VFQFN Exposed Pad, CSP
- Current - Supply:1 µA
- Interface:-
- Supplier Device Package:32-LFCSP-VQ (5x5)
- Touchscreen:-
- Voltage - Supply:2.7V ~ 5.25V
- Resolution ( Bits):12 b
- Voltage Reference:External, Internal
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD7877ACP-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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