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1 : $3.4560
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Rochester Electronics AD7873BCPZ
IC ADC 12BIT TOUCHSCREEN 16LFCSP
Manufacturer # :AD7873BCPZ
Manufacturer :Rochester Electronics
Dasenic # :AD7873BCPZ-DS
Datasheet :
AD7873BCPZ Datasheet
AD7873BCPZ DatasheetCustomer # :
Description : IC ADC 12BIT TOUCHSCREEN 16LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 3.4560 | $ 3.46 |
| 25+ | $ 3.3840 | $ 84.6 |
| 100+ | $ 3.2490 | $ 324.9 |
| 500+ | $ 3.1140 | $ 1557 |
| 1000+ | $ 2.9340 | $ 2934 |
In Stock: 4710
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.456
Total :$ 3.46
Delivery :
Payment :
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AD7873BCPZ information
Rochester Electronics AD7873BCPZ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Touch Screen Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:16-VQFN Exposed Pad, CSP
- Current - Supply:-
- Interface:-
- Supplier Device Package:16-LFCSP-VQ (4x4)
- Touchscreen:-
- Voltage - Supply:2.2V ~ 5.25V
- Resolution ( Bits):12 b
- Voltage Reference:External, Internal
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD7873BCPZ provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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