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1 : $0.0090
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Rochester Electronics AD7843ARU-REEL
IC ADC 12BIT TOUCHSCREEN 16TSSOP
Manufacturer # :AD7843ARU-REEL
Manufacturer :Rochester Electronics
Dasenic # :AD7843ARU-REEL-DS
Datasheet :
AD7843ARU-REEL Datasheet
AD7843ARU-REEL DatasheetCustomer # :
Description : IC ADC 12BIT TOUCHSCREEN 16TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0090 | $ 0.01 |
| 10+ | $ 0.0090 | $ 0.09 |
| 100+ | $ 0.0090 | $ 0.9 |
| 500+ | $ 0.0090 | $ 4.5 |
| 1000+ | $ 0.0090 | $ 9 |
In Stock: 52591
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
Delivery :
Payment :
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AD7843ARU-REEL information
Rochester Electronics AD7843ARU-REEL technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Touch Screen Controllers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Current - Supply:-
- Interface:-
- Supplier Device Package:16-TSSOP
- Touchscreen:-
- Voltage - Supply:2.2V ~ 5.25V
- Resolution ( Bits):12 b
- Voltage Reference:External
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD7843ARU-REEL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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