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1 : $25.2630
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Rochester Electronics AD7575AQ
IC ADC 8BIT SAR 18CDIP
Manufacturer # :AD7575AQ
Manufacturer :Rochester Electronics
Dasenic # :AD7575AQ-DS
Datasheet :
AD7575AQ Datasheet
AD7575AQ DatasheetCustomer # :
Description : IC ADC 8BIT SAR 18CDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 25.2630 | $ 25.26 |
| 1000+ | $ 13.7790 | $ 13779 |
In Stock: 4455
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 25.263
Total :$ 25.26
Delivery :
Payment :
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AD7575AQ information
Rochester Electronics AD7575AQ technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
- Product Status:Active
- Operating Temperature:-25°C ~ 85°C
- Features:-
- Mounting Type:Through Hole
- Package / Case:18-CDIP (0.300", 7.62mm)
- Input Type:Single Ended
- Supplier Device Package:18-CERDIP
- Configuration:S/H-ADC
- Sampling Rate ( Per Second):-
- Data Interface:Parallel
- Number of Bits:8
- Voltage - Supply, Analog:5V
- Voltage - Supply, Digital:5V
- Number of Inputs:1
- Ratio - S/ H: A D C:1:1
- Number of A/ D Converters:1
- Architecture:SAR
- Reference Type:External
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AD7575AQ provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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