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1 : $2.3130

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Rochester Electronics AD7153BRMZ

IC CAP TO DGT CNVRT 12BIT 10MSOP
part number has RoHS
Manufacturer # :AD7153BRMZ
Manufacturer :Rochester Electronics
Dasenic # :AD7153BRMZ-DS
Customer # :
Description : IC CAP TO DGT CNVRT 12BIT 10MSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.3130$ 2.31
25+$ 2.2680$ 56.7
100+$ 2.1780$ 217.8
500+$ 2.0790$ 1039.5
1000+$ 1.9620$ 1962
In Stock: 1537
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.313
Total :$ 2.31
Delivery :
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Payment :
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AD7153BRMZ information

  • Rochester Electronics AD7153BRMZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Type:Capacitance-to-Digital Converter
  • Number of Channels:1
  • Supplier Device Package:10-MSOP
  • Voltage - Supply:2.7V ~ 3.6V
  • Resolution ( Bits):12 b
  • Sampling Rate ( Per Second):-
  • Data Interface:Serial
  • Voltage Supply Source:Single Supply
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD7153BRMZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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