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Rochester Electronics AD676BD

IC ADC 16BIT SAR 28CDIP
part number has RoHS
Manufacturer # :AD676BD
Manufacturer :Rochester Electronics
Dasenic # :AD676BD-DS
Customer # :
Description : IC ADC 16BIT SAR 28CDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 33.3000$ 33.3
In Stock: 34585
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 33.3
Total :$ 33.30
Delivery :
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AD676BD information

  • Rochester Electronics AD676BD technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Analog to Digital Converters (ADC)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Mounting Type:Through Hole
  • Package / Case:28-CDIP (0.600", 15.24mm)
  • Input Type:Single Ended
  • Supplier Device Package:28-CDIP
  • Configuration:S/H-ADC
  • Sampling Rate ( Per Second):100k
  • Data Interface:Parallel
  • Number of Bits:16
  • Voltage - Supply, Analog:±12V
  • Voltage - Supply, Digital:5V
  • Number of Inputs:1
  • Ratio - S/ H: A D C:1:1
  • Number of A/ D Converters:1
  • Architecture:SAR
  • Reference Type:External
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD676BD provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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