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1 : $1020.9312
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Rochester Electronics AD6655BCPZ-125
IC IF RCVR 14BIT 125MSPS 64LFCSP
Manufacturer # :AD6655BCPZ-125
Manufacturer :Rochester Electronics
Dasenic # :AD6655BCPZ-125-DS
Datasheet :
AD6655BCPZ-125 Datasheet
AD6655BCPZ-125 DatasheetCustomer # :
Description : IC IF RCVR 14BIT 125MSPS 64LFCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1020.9312 | $ 1020.93 |
| 25+ | $ 1000.5231 | $ 25013.08 |
| 100+ | $ 959.7065 | $ 95970.65 |
| 500+ | $ 918.8159 | $ 459407.95 |
| 1000+ | $ 867.7953 | $ 867795.3 |
In Stock: 1839
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1020.9312
Total :$ 1020.93
Delivery :
Payment :
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AD6655BCPZ-125 information
Rochester Electronics AD6655BCPZ-125 technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Misc ICs and Modules
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:64-VFQFN Exposed Pad, CSP
- Frequency:450MHz
- Supplier Device Package:64-LFCSP-VQ (9x9)
- R F Type:Cellular, CDMA2000, EDGE, GSM, W-CDMA
- Secondary Attributes:32-Bit Numerically Controlled Oscillator
- Function:IF Diversity Receiver
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD6655BCPZ-125 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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