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Rochester Electronics AD594AQ

IC THERMOCOUPLE A W/COMP 14CDIP
part number has RoHS
Manufacturer # :AD594AQ
Manufacturer :Rochester Electronics
Dasenic # :AD594AQ-DS
Customer # :
Description : IC THERMOCOUPLE A W/COMP 14CDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
2+$ 24.2362$ 48.47
5+$ 19.8861$ 99.43
8+$ 19.2647$ 154.12
10+$ 18.6432$ 186.43
13+$ 18.0219$ 234.28
In Stock: 1794
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 24.2362
Total :$ 24.24
Delivery :
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Payment :
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AD594AQ information

  • Rochester Electronics AD594AQ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Thermal Management
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Mounting Type:Through Hole
  • Package / Case:14-CDIP (0.300", 7.62mm)
  • Output Type:Voltage
  • Supplier Device Package:14-CERDIP
  • Voltage - Supply:5V ~ ±15V
  • Sensor Type:External
  • Topology:Ice Point Compensation, Overload Detection
  • Accuracy:±3°C(Max)
  • Sensing Temperature:-
  • Output Alarm:Yes
  • Output Fan:No
  • Function:Thermocouple Amplifier
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD594AQ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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