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1 : $3.9402
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Rochester Electronics AD5678BRUZ-1
IC DAC 12/16BIT V-OUT 14TSSOP
Manufacturer # :AD5678BRUZ-1
Manufacturer :Rochester Electronics
Dasenic # :AD5678BRUZ-1-DS
Datasheet :
AD5678BRUZ-1 Datasheet
AD5678BRUZ-1 DatasheetCustomer # :
Description : IC DAC 12/16BIT V-OUT 14TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 33+ | $ 3.9402 | $ 130.03 |
In Stock: 9153
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.9402
Total :$ 3.94
Delivery :
Payment :
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AD5678BRUZ-1 information
Rochester Electronics AD5678BRUZ-1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width)
- Output Type:Voltage - Buffered
- Supplier Device Package:14-TSSOP
- Data Interface:SPI, DSP
- Number of Bits:12, 16
- Voltage - Supply, Analog:2.7V ~ 5.5V
- Voltage - Supply, Digital:2.7V ~ 5.5V
- Architecture:String DAC
- Reference Type:External, Internal
- Number of D/ A Converters:8
- Settling Time:10µs
- Differential Output:No
- I N L/ D N L ( L S B):±8, ±1 (Max)
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AD5678BRUZ-1 provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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