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  • Rochester Electronics AD5676BRUZ

    IC DAC 16BIT V-OUT 20TSSOP
  • part number has RoHS
  • Mfr.Part # :AD5676BRUZ
  • Manufacturer :Rochester Electronics
  • Dasenic # :AD5676BRUZ-DS
  • Datasheet :pdf download AD5676BRUZ Datasheet
  • Description : IC DAC 16BIT V-OUT 20TSSOP
  • Package :-
  • Quantity :
    Unit Price : $ 23.31Total : $ 23.31
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 6381
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 23.3100$ 23.31
10 +$ 17.2440$ 172.44
1000 +$ 9.7830$ 9783.00

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Rochester Electronics AD5676BRUZ technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Digital to Analog Converters (DAC)
Product Status:Active
Operating Temperature:-40°C ~ 125°C
Mounting Type:Surface Mount
Package / Case:20-TSSOP (0.173", 4.40mm Width)
Output Type:Voltage - Buffered
Supplier Device Package:20-TSSOP
Data Interface:SPI, DSP
Number of Bits:16
Voltage - Supply, Analog:2.7V ~ 5.5V
Voltage - Supply, Digital:1.8V ~ 5.5V
Architecture:String DAC
Reference Type:External
Number of D/ A Converters:8
Settling Time:8µs
Differential Output:No
I N L/ D N L ( L S B):±1.8, ±0.7
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
AD5676BRUZ provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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