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1 : $33.5250

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Rochester Electronics AD2S1210DSTZ

IC R/D CONV 10/12/14/16B 48LQFP
part number has RoHS
Manufacturer # :AD2S1210DSTZ
Manufacturer :Rochester Electronics
Dasenic # :AD2S1210DSTZ-DS
Customer # :
Description : IC R/D CONV 10/12/14/16B 48LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 33.5250$ 33.53
10+$ 25.3755$ 253.76
25+$ 23.2909$ 582.27
1000+$ 15.1740$ 15174
In Stock: 4683
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 33.525
Total :$ 33.52
Delivery :
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Payment :
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AD2S1210DSTZ information

  • Rochester Electronics AD2S1210DSTZ technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:48-LQFP
  • Type:R/D Converter
  • Number of Channels:2
  • Supplier Device Package:48-LQFP (7x7)
  • Voltage - Supply:4.75V ~ 5.25V
  • Resolution ( Bits):10, 12, 14, 16 b
  • Sampling Rate ( Per Second):-
  • Data Interface:Serial, Parallel
  • Voltage Supply Source:Analog and Digital
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
AD2S1210DSTZ provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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