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  • Rochester Electronics AD1847JP

    16-BIT SOUNDCOMM CODEC
  • part number has RoHS
  • Mfr.Part # :AD1847JP
  • Manufacturer :Rochester Electronics
  • Dasenic # :AD1847JP-DS
  • Datasheet :pdf download AD1847JP Datasheet
  • Description : 16-BIT SOUNDCOMM CODEC
  • Package :-
  • Quantity :
    Unit Price : $ 76.104Total : $ 76.10
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
    paypalwiretransferpaypal02paypal04
In Stock: 12047
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 76.1040$ 76.10
25 +$ 74.6176$ 1865.44
100 +$ 71.5705$ 7157.05
500 +$ 68.5233$ 34261.65
1000 +$ 64.6587$ 64658.70

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Rochester Electronics AD1847JP technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/CODECs
Product Status:Active
Operating Temperature:0°C ~ 70°C (TA)
Mounting Type:Surface Mount
Package / Case:44-LCC (J-Lead)
Type:Stereo Audio
Supplier Device Package:44-PLCC (16.59x16.59)
Resolution ( Bits):16 b
Data Interface:Parallel, Serial
Voltage - Supply, Analog:4.75V ~ 5.25V
Voltage - Supply, Digital:4.75V ~ 5.25V
Number of A D Cs / D A Cs:2 / 2
Sigma Delta:Yes
S/ N Ratio, A D Cs / D A Cs (db) Typ:-
Dynamic Range, A D Cs / D A Cs (db) Typ:70 / 76
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
AD1847JP provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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