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Rochester Electronics A7002CGHN1/T1AG502

SECURE AUTHENTICATION MICROCONTR
part number has RoHS
Manufacturer # :A7002CGHN1/T1AG502
Manufacturer :Rochester Electronics
Dasenic # :A7002CGHN1/T1AG502-DS
Customer # :
Description : SECURE AUTHENTICATION MICROCONTR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.2660$ 4.27
25+$ 4.1850$ 104.63
100+$ 4.0140$ 401.4
500+$ 3.8430$ 1921.5
1000+$ 3.6270$ 3627
In Stock: 19470
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.266
Total :$ 4.27
Delivery :
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Payment :
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A7002CGHN1/T1AG502 information

  • Rochester Electronics A7002CGHN1/T1AG502 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers - Application Specific
  • Product Status:Active
  • Operating Temperature:-40°C ~ 90°C
  • Mounting Type:Surface Mount
  • Package / Case:32-VFQFN Exposed Pad
  • Interface:I²C
  • Supplier Device Package:32-HVQFN (5x5)
  • Voltage - Supply:1.62V ~ 5.5V
  • Number of I/ O:-
  • Core Processor:MX51
  • R A M Size:3.2kB
  • Program Memory Type:EEPROM (76.4kB)
  • Controller Series:A700x
  • Applications:Authentication
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
A7002CGHN1/T1AG502 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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