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1 : $1.1520
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Rochester Electronics 93C66-I/SM
512 X 8 SERIAL EEPROM
Manufacturer # :93C66-I/SM
Manufacturer :Rochester Electronics
Dasenic # :93C66-I/SM-DS
Datasheet :
93C66-I/SM Datasheet
93C66-I/SM DatasheetCustomer # :
Description : 512 X 8 SERIAL EEPROM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.1520 | $ 1.15 |
| 100+ | $ 1.0714 | $ 107.14 |
| 1000+ | $ 1.0368 | $ 1036.8 |
| 10000+ | $ 0.9792 | $ 9792 |
In Stock: 13443
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.152
Total :$ 1.15
Delivery :
Payment :
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93C66-I/SM information
Rochester Electronics 93C66-I/SM technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:-
- Package / Case:-
- Technology:EEPROM
- Supplier Device Package:-
- Memory Size:4Kb (512 x 8, 256 x 16)
- Memory Type:Non-Volatile
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:2 MHz
- Access Time:-
- Memory Format:EEPROM
- Memory Interface:SPI
- Write Cycle Time - Word, Page:2ms
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.32.0051
- China RoHS Status:Green Symbol: Green and environmentally friendly product
93C66-I/SM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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