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1 : $0.5120
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Rochester Electronics 74HC10FPEL-E
IC GATE NAND 3CH 3 INP
Manufacturer # :74HC10FPEL-E
Manufacturer :Rochester Electronics
Dasenic # :74HC10FPEL-E-DS
Datasheet :
74HC10FPEL-E Datasheet
74HC10FPEL-E DatasheetCustomer # :
Description : IC GATE NAND 3CH 3 INP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.5120 | $ 0.51 |
| 25+ | $ 0.5018 | $ 12.55 |
| 100+ | $ 0.4813 | $ 48.13 |
| 500+ | $ 0.4608 | $ 230.4 |
| 1000+ | $ 0.4352 | $ 435.2 |
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.512
Total :$ 0.51
Delivery :
Payment :
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74HC10FPEL-E information
Rochester Electronics 74HC10FPEL-E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Gates and Inverters
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Features:-
- Mounting Type:-
- Package / Case:-
- Supplier Device Package:-
- Number of Circuits:3
- Voltage - Supply:2V ~ 6V
- Number of Inputs:3
- Current - Quiescent ( Max):2 µA
- Logic Type:NAND Gate
- Current - Output High, Low:5.2mA, 5.2mA
- Max Propagation Delay @ V, Max C L:16ns @ 6V, 50pF
- Logic Level - Low:0.5V ~ 1.8V
- Logic Level - High:1.5V ~ 4.2V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
74HC10FPEL-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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