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Rochester Electronics 74F30SCX

NAND GATE
part number has RoHS
Manufacturer # :74F30SCX
Manufacturer :Rochester Electronics
Dasenic # :74F30SCX-DS
Customer # :
Description : NAND GATE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.2600$ 1.26
25+$ 1.2330$ 30.83
100+$ 1.1880$ 118.8
500+$ 1.1340$ 567
1000+$ 1.0710$ 1071
In Stock: 15000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.26
Total :$ 1.26
Delivery :
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Payment :
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74F30SCX information

  • Rochester Electronics 74F30SCX technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Gates and Inverters
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:14-SOIC
  • Number of Circuits:1
  • Voltage - Supply:4.5V ~ 5.5V
  • Number of Inputs:8
  • Current - Quiescent ( Max):4.5 mA
  • Logic Type:NAND Gate
  • Current - Output High, Low:1mA, 20mA
  • Max Propagation Delay @ V, Max C L:5ns @ 5V, 50pF
  • Logic Level - Low:0.8V
  • Logic Level - High:2V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74F30SCX provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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