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Rochester Electronics 74F114SCX

J-K FLIP-FLOP
part number has RoHS
Manufacturer # :74F114SCX
Manufacturer :Rochester Electronics
Dasenic # :74F114SCX-DS
Customer # :
Description : J-K FLIP-FLOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1267$ 0.13
25+$ 0.1242$ 3.11
100+$ 0.1192$ 11.92
500+$ 0.1140$ 57
1000+$ 0.1077$ 107.7
In Stock: 6419
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1267
Total :$ 0.13
Delivery :
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Payment :
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74F114SCX information

  • Rochester Electronics 74F114SCX technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Flip Flops
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:14-SOIC (0.154", 3.90mm Width)
  • Type:JK Type
  • Output Type:Complementary
  • Supplier Device Package:14-SOIC
  • Number of Elements:2
  • Voltage - Supply:4.5V ~ 5.5V
  • Clock Frequency:95 MHz
  • Number of Bits per Element:1
  • Current - Output High, Low:1mA, 20mA
  • Max Propagation Delay @ V, Max C L:7.5ns @ 5V, 50pF
  • Current - Quiescent ( Iq):19 mA
  • Trigger Type:Negative Edge
  • Input Capacitance:-
  • Function:Set(Preset) and Reset
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74F114SCX provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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