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Rochester Electronics 74AUP2G97DP,118

NOW NEXPERIA 74AUP2G97DP - MAJOR
part number has RoHS
Manufacturer # :74AUP2G97DP,118
Manufacturer :Rochester Electronics
Dasenic # :74AUP2G97DP,118-DS
Customer # :
Description : NOW NEXPERIA 74AUP2G97DP - MAJOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2430$ 0.24
10+$ 0.2333$ 2.33
100+$ 0.2187$ 21.87
1000+$ 0.2163$ 216.3
10000+$ 0.2138$ 2138
In Stock: 49246
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.243
Total :$ 0.24
Delivery :
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Payment :
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74AUP2G97DP,118 information

  • Rochester Electronics 74AUP2G97DP,118 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Gates and Inverters - Multi-Function, Configurable
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
  • Output Type:Single-Ended
  • Supplier Device Package:10-TSSOP
  • Number of Circuits:2
  • Voltage - Supply:0.8V ~ 3.6V
  • Number of Inputs:3
  • Logic Type:Configurable Multiple Function
  • Current - Output High, Low:4mA, 4mA
  • Schmitt Trigger Input:Yes
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74AUP2G97DP,118 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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