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Rochester Electronics 74AUP2G32GN115

IC GATE OR 2CH 2-INP 8XSON
part number has RoHS
Manufacturer # :74AUP2G32GN115
Manufacturer :Rochester Electronics
Dasenic # :74AUP2G32GN115-DS
Customer # :
Description : IC GATE OR 2CH 2-INP 8XSON
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.6660$ 6.66
5000+$ 0.3700$ 1850
10000+$ 0.3620$ 3620
25000+$ 0.3560$ 8900
50000+$ 0.3480$ 17400
In Stock: 10
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.666
Total :$ 0.67
Delivery :
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Payment :
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74AUP2G32GN115 information

  • Rochester Electronics 74AUP2G32GN115 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gates and Inverters
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:8-XFDFN
  • Supplier Device Package:8-XSON (1.2x1)
  • Number of Circuits:2
  • Voltage - Supply:0.8V ~ 3.6V
  • Number of Inputs:2
  • Current - Quiescent ( Max):500 nA
  • Logic Type:OR Gate
  • Current - Output High, Low:4mA, 4mA
  • Max Propagation Delay @ V, Max C L:6.4ns @ 3.3V, 30pF
  • Logic Level - Low:0.7V ~ 0.9V
  • Logic Level - High:1.6V ~ 2V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74AUP2G32GN115 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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