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Rochester Electronics 74AUP1G14GS132

IC INVERT SCHMITT 1CH 1-IN 6XSON
part number has RoHS
Manufacturer # :74AUP1G14GS132
Manufacturer :Rochester Electronics
Dasenic # :74AUP1G14GS132-DS
Customer # :
Description : IC INVERT SCHMITT 1CH 1-IN 6XSON
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.9315$ 9.32
2000+$ 0.6210$ 1242
10000+$ 0.6210$ 6210
In Stock: 6027
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9315
Total :$ 0.93
Delivery :
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74AUP1G14GS132 information

  • Rochester Electronics 74AUP1G14GS132 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gates and Inverters
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Features:Schmitt Trigger
  • Mounting Type:Surface Mount
  • Package / Case:6-XFDFN
  • Supplier Device Package:6-XSON, SOT1202 (1x1)
  • Number of Circuits:1
  • Voltage - Supply:0.8V ~ 3.6V
  • Number of Inputs:1
  • Current - Quiescent ( Max):500 nA
  • Logic Type:Inverter
  • Current - Output High, Low:4mA, 4mA
  • Max Propagation Delay @ V, Max C L:6.1ns @ 3.3V, 30pF
  • Logic Level - Low:0.1V ~ 0.88V
  • Logic Level - High:0.6V ~ 2.29V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
74AUP1G14GS132 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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