Rochester Electronics 74ABT16374BDGG,112

Name: 74ABT16374BDGG,112
Brand: Rochester Electronics
SKU: 74ABT16374BDGG,112-DS
Price: 0.3960 USD
Availability: InStock
Rating: 4.8 (42 reviews)

in_stock: 16234

MOQ: 1

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Manufacturer_part :74ABT16374BDGG,112
Manufacturer :Rochester Electronics
Dasenic_Part :74ABT16374BDGG,112-DS
Datasheet : 74ABT16374BDGG,112 Datasheet PDF
Description : IC FF D-TYPE DUAL 8BIT 48TSSOP
package :-
unit_price: $0.3960
total: $0.40

Quantity	unit_price	You Save
1-1	$0.3960	-
2-10	$0.3762	5.0% save
11-100	$0.3564	10.0% save
101-1000	$0.3524	11.0% save
1001-10000	$0.3485	12.0% save

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Rochester Electronics 74ABT16374BDGG,112 technical_specifications

Category:Integrated Circuits (ICs)/Flip Flops

Product Status:Obsolete

Operating Temperature:-40°C ~ 85°C (TA)

Mounting Type:Surface Mount

Package / Case:48-TFSOP (0.240", 6.10mm Width)

Type:D-Type

Output Type:Tri-State, Non-Inverted

Supplier Device Package:48-TSSOP

Number of Elements:2

Voltage - Supply:4.5V ~ 5.5V

Clock Frequency:260 MHz

Number of Bits per Element:8

Current - Output High, Low:32mA, 64mA

Max Propagation Delay @ V, Max C L:4ns @ 5V, 50pF

Current - Quiescent ( Iq):2 mA

Trigger Type:Positive Edge

Input Capacitance:4 pF

Function:Standard

EU RoHS Status:RoHS Compliant

REACH Status:Vendor is not defined

US ECCN:Provided as per user requirements

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

74ABT16374BDGG,112 provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.