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1 : $1.5570
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Rochester Electronics 71V632S8PFG
IC SRAM 2MBIT PARALLEL 100TQFP
Manufacturer # :71V632S8PFG
Manufacturer :Rochester Electronics
Dasenic # :71V632S8PFG-DS
Datasheet :
71V632S8PFG Datasheet
71V632S8PFG DatasheetCustomer # :
Description : IC SRAM 2MBIT PARALLEL 100TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.5570 | $ 1.56 |
| 25+ | $ 1.5300 | $ 38.25 |
| 100+ | $ 1.4670 | $ 146.7 |
| 500+ | $ 1.4040 | $ 702 |
| 1000+ | $ 1.3230 | $ 1323 |
In Stock: 1799
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.557
Total :$ 1.56
Delivery :
Payment :
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71V632S8PFG information
Rochester Electronics 71V632S8PFG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-LQFP
- Technology:SRAM - Synchronous, SDR
- Supplier Device Package:100-TQFP (14x14)
- Memory Size:2Mb (64K x 32)
- Memory Type:Volatile
- Voltage - Supply:3.135V ~ 3.63V
- Clock Frequency:-
- Access Time:8 ns
- Memory Format:SRAM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
71V632S8PFG provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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